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Circuit/Semiconductor Materials

LG Chem achieved growth mainly based on high value products.
LG Chem boasts competitiveness in the materials used for PCB and semiconductors
such as CCL and DAF. The market for CCL keeps growing centering on the high value
products for IC package.

Use of Product

TV, Monitor, Laptop, Tablet, Smartphone

Functions of Circuit/Semiconductor Materials

CCL(Copper Clad Laminate)
This material is used in an IC-PKG circuit board, providing electrical connectivity to a semiconductor chip and protecting it from external impact.
DAF(Die Attach Film)
DAF is a film used to bond a die with a substrate or with another die during the manufacturing process of a semiconductor package.

Product Classification

Product Classification : Category, Grade, Properties
Category Grade Properties
CCL(IC-PKC用) LG-500GA
  • General-purpose material
  • Excellent blanking processability
LG-500LC Series
  • Material with low thermal expansion
  • Excellent flatness properties
DAF
* It prevents bouncing and cracks
during the bonding process of
semiconductor chips.
It needs to have high adhesiveness
and reliability in the package.
Normal DAF
  • An adhesive film for semiconductors that can be used in the chip-to-chip or chip-to-substrate bonding.
  • Void is removed during molding.
  • Excellent adhesiveness and reliability
FOW
(Film Over Wire)
  • Adhesive film impregnated with wire
  • Void is removed during the pre-curing (pre-curing is necessary before wire bonding).
  • Low fillet. Excellent wire impregnability
  • High reliability (Excellent HAST properties)
FOD
(Film Over Die)
  • Adhesive film impregnated with controller chip
  • Void is removed during the pre-curing (pre-curing is necessary before wire bonding).
  • Excellent void properties near a controller chip and wire.
  • Minimal substrate warpage after pre-curing. Excellent flatness properties

Contact

  • CCL/DAF
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