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Semiconductor Processing Materials

Semiconductor package processing material based on adhesion technologies
With its distinct adhesion technology, LG Chem supplies adhesive materials
necessary for semiconductor packaging processes, such as DAF, BGT, etc.

BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties.

Product functions

  • Easy removal after back grinding process
  • Protects wafer pattern surface and prevents damages to edges
  • Warpage minimization
  • Stable processability

Product structure

BGT-ST
  • PU Film
  • UV Curable PSA
  • PET Film
BGT-TD
  • PU Coated Film
  • UV Curable PSA
  • PET Film
BGT-BU
  • PO Film
  • Interlayer PSA
  • UV Curable PSA
  • PET Film

Product classification

Product classification : Application, Film Thickness (μm), Features
Application Film Thickness (μm) Features
BGT-ST
(Standard)
150 ~ 200
  • Standard type
  • Low warpage and burr&residue-free
BGT-TD
(for thin layer die)
100 ~ 150
  • For GAL/DBG processes
  • High Shear Strength (Low Die-shift)
BGT-BU
(for bump)
200 ~ 350
  • For bumps
  • Excellent bump adhesion

Contact

  • BGT
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