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Semiconductor Substrate Materials

A wide range of semiconductor substrate line-up
LG Chem supplies key materials for semiconductor substrate, such as CCL,
PPG, RCC, etc., from a wide range of line-up. The company provides optimal solutions
for key parts of cutting-edge devices in line with miniaturization and
multi-functionalization, with its secure and distinguished competitiveness.

PPG(Pre Preg) is manufactured by impregnating glass fibers with resin and then hardening them, and plays the role of a bonding sheet in the stacking process of package substrate(connects semiconductors to PCB). CCL, a laminated Cu foil layer formed by coating both sides of PPG with copper, plays the role of an insulator. CCL and PPG are key materials of a semiconductor's IC package substrate. With their excellent electrical characteristics and reliability, they make possible miniaturization and thin-layer manufacturing of semiconductor devices.

Use of Product

PC/server DRAM, mobile DRAM, NAND, graphic DRAM, SiP/communication semiconductor(5G)

Product functions and structure

  • Excellent flip chip solutions with fine thickness control and non-wet free characteristic
  • War page control solution with low stress and low shrinking rate
  • Can produce thin-layered board with high strength
  • Can produce high-speed/low-loss substrate with low Dk&Df
  • Cu foil
  • Thermosetting resin
  • Inorganic composite
  • Glass fiber
  • Thermosetting resin
  • Inorganic composite
  • Glass fiber

Emblem Wheel Garnish

Product classification

Product classification : Use, Features
Use Features
PC/server DRAM
  • BOC: general-purpose product
  • Flip chip: excellent flip chip joining solution with low Dk(non-wet free)
Graphic DRAM
  • Can handle high-speed processing with low Dk
    Has excellent flip chip joining solution with low Dk(non-wet free)
Mobile DRAM
  • Has product line-up that is responsive to various CTE and stresses
  • Can produce thin and high-strength substrate
  • Can provide low and optimal warpage control with a wide range of responses to Tg
  • Has excellent anti-crack feature and high reliability from T/C(Thermo Cycle) test
NAND
  • Has product line up responsive to various CTE characteristics
  • Can produce thin and high-strength substrate
  • Has excellent anti-crack feature and high reliability from T/C(Thermo Cycle) test
SiP/communication
semiconductor(5G)
  • Can produce high-speed/low-loss substrate with low Dk&Df
  • Has wide process margin and excellent processability

* Thickness: CCL 25~400μm/PPG 15~90μm

Contact

  • CCL/PPG
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