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Semiconductor Substrate Materials

A wide range of semiconductor substrate line-up
LG Chem supplies key materials for semiconductor substrate, such as CCL,
PPG, RCC, etc., from a wide range of line-up. The company provides optimal solutions
for key parts of cutting-edge devices in line with miniaturization and
multi-functionalization, with its secure and distinguished competitiveness.

RCC(Resin Coated Copper) is a product made by coating resin on a Cu foil without using glass fibers. It plays the role of a bonding sheet in the manufacturing process of thin substrates. It is a key material for the build-up PCB, and makes possible miniaturization and thin-layer manufacturing of semiconductor devices based on its excellent electrical characteristic and reliability.

Use of Product

Mobile DRAM, NAND, SiP

Product functions and structure

  • Solution with excellent anti-crack characteristic
  • Can superbly control thickness through great fluidity
  • Provides easy handling and processability with no stickiness
  • Solution for realizing ultra thin-layered substrate
  • Thermosetting resin
  • Inorganic composite
  • Cu foil

Emblem Wheel Garnish

Product classification

Product classification : Use, Thickness(μm), Features
Use Thickness(μm) Features
Mobile DRAM 10 ~ 60
  • Can produce ultra thin void free substrate
  • Has high strength, excellent anti-crack characteristic, and high reliability from T/C(Thermo Cycle) test
  • Cover Layer Film Free
NAND
  • Can produce ultra thin void free substrate
  • Has high strength, excellent anti-crack characteristic, and high reliability from T/C(Thermo Cycle) test
  • Cover Layer Film Free
SiP
  • Can produce high-speed substrate with low Dk
  • Can produce ultra thin void free substrate
  • Has high strength, excellent anti-crack characteristic, and high reliability from T/C(Thermo Cycle) test
  • Cover Layer Film Free

Contact

  • RCC
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