PETROCHEMICALS INFORMATION & ELECTRONIC MATERIALS Optical & Display Materials Printed Circuit Materials Toners Batteries Batteries Product Search Home > Products > INFORMATION & ELECTRONIC MATERIALS > Printed Circuit Materials Printed Circuit Materials Flexible Materials ubiFLEX Adhesiveless flexible polyimide copper clad laminate for dynamic flexible circuit   No-Flow Pregrep     Halogen Free Materials Halogen free and lead free dielectric substrate material characterized with 155°C glass transition temperature (Tg) FR4 system. Halogen free laminate LG-E(B)-481 LG-E(B)-481 does not contain any halogenated flame retardants(Bromine, Chlorine, antimony or red phosphorus) in compliance with environmental legislation in Asia(Japan etc.), Europe etc.   IC Packaging Materials Thermally stable and high stiffness laminate for IC packages. (PBGA, CSP, BOC) Laminate for PBGA LG-P(B)-500PN LG-P-500PN is a black colored laminate(prepreg) with excellent thermal, chemical, moisture resistance, through hole reliability and BT equivalent with alternative low cost.   Laminate for CSP LG-P(B)-500IE LG-P-500IE is fine patternable, low Dk/Df chip-packaging materials for specific application of high density & reliability and BT equivalent with alternative low cost.   FR4 Epoxy Resin System Materials The most commonly used family of laminate and the standard for most printed circuit applications. Phenolic cured / CAF resistant LG-E(B)-451H(Phenolic cured / CAF resistant) LG-E(B)-451H is a FR-5 equivalent material characterized with its high Tg, improved thermal reistance, enhanced through-hole reliability, anti-CAF characteristics and low Z axis expansion.   FR5 Epoxy Resin System Materials Dicy Hi-Tg LG-E(B)-451HD(Dicy cured) LG-E(B)-451HD has the excellent processability with superior through-hole reliability, dimensional stability and outstanding thermal stability.   High Speed Materials Next generation material designed for high speed, low loss and RF applications. Low Dk/Df LG-E(B)-200LL LG-E(B)-200LL is an advanced epoxy resin system material with low dielectric constant (Dk = 3.4, at 1GHz) and low dissipation factor. (Df=0.005 at 1GHz)   Build-up Materials LG-F-2000 -RCC(Resin Coated Copper Foil) LG-F-2000 is a multifunctional epoxy resin coated copper foil for HDI build up multilayers printed circuit boards.

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