Advanced Materials

Every since the company succeeded in commercializing polarizers
for LCDs for the first time in Korea, LG Chem has increased its
global competitiveness in the display and IT device material areas
where cutting edge technologies are converged.

  • Automotive Materials
  • Display Materials
  • Semiconductor Materials
  • Rechargeable Battery Materials
  • Water Treatment Materials

Semiconductor Substrate Materials

A wide range of semiconductor substrate line-up
LG Chem supplies key materials for semiconductor substrate, such as CCL, PPG, RCC, etc., from a wide range of line-up. The company provides optimal solutions for key parts of cutting-edge devices in line with miniaturization and multi-functionalization, with its secure and distinguished competitiveness.

Use of Product

PC/server DRAM, Mobile DRAM, NAND, Graphic DRAM, Sip

  • CCL/PPG

    PPG(Pre Preg) is manufactured by impregnating glass fibers with resin and then hardening them, and plays the role of a bonding sheet in the stacking process of package substrate(connects semiconductors to PCB). CCL, a laminated Cu foil layer formed by coating both sides of PPG with copper, plays the role of an insulator. CCL and PPG are key materials of a semiconductor's IC package substrate. With their excellent electrical characteristics and reliability, they make possible miniaturization and thin-layer manufacturing of semiconductor devices.

  • RCC

    RCC(Resin Coated Copper) is a product made by coating resin on a Cu foil without using glass fibers. It plays the role of a bonding sheet in the manufacturing process of thin substrates. It is a key material for the build-up PCB, and makes possible miniaturization and thin-layer manufacturing of semiconductor devices based on its excellent electrical characteristic and reliability.

Semiconductor Processing Materials

Semiconductor package processing material based on adhesion technologies
With its distinct adhesion technology, LG Chem supplies adhesive materials necessary for semiconductor packaging processes, such as DAF, BGT, etc.

Use of Product

PC/server, Graphic DRAM, Mobile DRAM, NAND, AP, Fingerprint sensor

  • DAF

    DAF(Die Attach Film) is an ultra-thin film adhesive used to connect semiconductor chips to circuit boards or chips to chips in the semiconductor packaging process. It is an essential material used in manufacturing flash memories, etc. in the post-manufacturing process of semiconductors. Lamination and manufacturing of thin layers of semiconductors are possible with its excellent reliability and easy processability.

  • BGT

    BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties.