DAF

Die Attach Film
Die Attach Film
Die Attach Film

Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

DAF(Die Attach Film) is an ultra-thin film adhesive used to connect semiconductor chips to circuit boards or chips to chips in the semiconductor packaging process. It is an essential material used in manufacturing flash memories, etc. in the post-manufacturing process of semiconductors. Lamination and manufacturing of thin layers of semiconductors are possible with its excellent reliability and easy processability.

Applications

PC/server

PC/server

graphic DRAM

graphic DRAM

mobile DRAM

mobile DRAM

NAND

NAND

AP

AP

fingerprint sensor

fingerprint sensor

Product Functions and Structure

· Has excellent pick-up characteristic and processability
· Has void free and anti-heat characteristics and excellent reliability
· Has excellent burial ability through viscosity and cure control

DAF Process

DAF 제조 공정 : Wafer Backside Lamination(WBL), Dicing(Sawing), UV/Expanding, Die Bonding, Chip th substrate
DAF 제조 공정 : Wafer Backside Lamination(WBL), Dicing(Sawing), UV/Expanding, Die Bonding, Chip th substrate

Product Group

    Product Classification

    Product Classification :Category ,Grade ,Features ,Applications ,Download
    Category Grade Features Applications Download
    DAF
    Normal
    * Thickness (μm) : 5/ 10 / 20 * Mold Void Free * Can support various dicing processes such as Blade/GAL/DBG
    Chip-to-chip or chip-to-board adhesive film
    DAF
    FOW(Film over Wire)
    *Thickness (μm) : 50 ~ 80 * Pre-cure Void Free *Has excellent fillet and wire burying ability * Has excellent HAST reliability
    Wire-burial type adhesive film
    DAF
    FOD(Film over Die)
    * Thickness (μm) : 90~120 * Pre-cure Void Free * Has excellent controller chip and great void characteristic around wire * Has excellent HAST reliability * Can support various dicing processes such as Blade/GAL/DBG * GAL process is possible
    Controller chip burial type adhesive film
    알림
    알림
    1:1 Inquiries