DAF

Die Attach Film

Ultra-Thin Film Adhesive Materials for Semiconductor Package Stacking and Thinning

DAF (Die Attach Film) is an ultra-thin film adhesive used in semiconductor packaging processes to bond semiconductor chips to substrates or to other chips.
By integrating the dicing tape—which supports the wafer during singulation—and the die bonding tape—which attaches the chip to the substrate—DAF simplifies the packaging process.
It is an essential material in the back-end processes of high-density semiconductors such as flash memory, enabling package stacking and thinning thanks to its excellent reliability and processibility.

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Applications

PC / Server / Graphics DRAM

Mobile DRAM

NAND

Fingerprint Sensor

Product Functions and Structure

• Stable bonding quality ensured through uniform thickness control
• Improved reliability through excellent gap-filling characteristics and void-free bonding after die attach cure
• High adhesion strength enables highly reliable bonding to various substrates and chips
• Excellent heat resistance and reliability for high-temperature processes and thermal cycling environments
• Easy pick-up and excellent processability
• Compatible with both blade and laser dicing processes

DAF Process

Product Group

Advanced Adhesive Products and Their Functions

LG Chem in Everyday Life

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[DAF] Producing thin fingerprint recognition sensors

Fingerprints are curved patterns on the fingertips that everyone has since birth as a physical at...

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Product Classification

Product Classification :Category ,Grade ,Features ,Applications ,Download
Category	Grade	Features	Applications
DAF	Normal	• Bonding between chip and substrate or between chips • Void-free after molding • Excellent reliability and high thermal budget • Compatible with both blade and laser dicing processes	Thickness : 5, 10, 20㎛
DAF	FOW(Film over Wire)	• Capable of chip-to-chip bonding and wire embedding • Void-free implementation after die attach curing • Excellent wire embedding characteristics • Compatible with both blade and laser dicing processes	Thickness : 40, 50, 60 ㎛
DAF	FOD(Film over Die)	• Chip embedding and bonding • Excellent embedding characteristics for controllers, chips, and wires • Outstanding HAST (Highly Accelerated Stress Test) reliability • Minimized fillet formation • Compatible with both blade and laser dicing processes	Thickness : 100 ~ 120㎛

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A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Company name, Email, Phone number, Region

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If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

Holding data according to our internal policies - Retained items: Company name, Email, Phone number, Region, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

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Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

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Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Company name, Email, Phone number, Region	Korea

I agree to the Collection/Usage of Personal Information.

1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Company name, Email, Phone number

B. The data below may be automatically generated or collected when you use the Service.

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

3. Period for Holding and Using Personal Data

If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Company name, Email, Phone number, Region	Korea

I agree to the Collection/Usage of Personal Information.

1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Email, Phone number

B. The data below may be automatically generated or collected when you use the Service.

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

3. Period for Holding and Using Personal Data

If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

Holding data according to our internal policies - Retained items: Email, Phone number, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Email, Phone number	Korea

I agree to the Collection/Usage of Personal Information.