BGT
Material which protects the wafer surface during back grinding
BGT (Back Grinding Tape) is a protective tape applied to the wafer surface after IC circuits are formed, during the back grinding process. It is directly attached to the circuit side to prevent substrate damage and surface contamination, while enhancing the precision of the grinding process. With excellent physical and chemical properties, BGT reliably protects the wafer pattern and chips throughout processing, contributing to the realization of high-quality packaging.
Applications
Product functions
• Maintains uniform thickness with excellent TTV (Total Thickness Variation) control
• Prevents chip damage by protecting the pattern side and minimizing die shift
• Enhances process stability by absorbing shock and foreign particles generated during back grinding
• Enables clean separation without residue through easy removal after UV exposure
Product structure
