BGT

Wafer Backside Grinding Tape
BGT Wafer Backside Grinding Tape LG Chem Advanced Materials Material which protects the wafer surface during back grinding
BGT Wafer Backside Grinding Tape LG Chem Advanced Materials Material which protects the wafer surface during back grinding

Material which protects the wafer surface during back grinding

BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties.

Product functions

· Easy removal after back grinding process
· Protects wafer pattern surface and prevents damages to edges
· Warpage minimization
· Stable processability

1. BGT Process: Mounting, Grinding, Peeling; 2. Dicing Process: Dicing Tape, Sawing, Pick-up; 3. Device Conveyance Process
1. BGT Process: Mounting, Grinding, Peeling; 2. Dicing Process: Dicing Tape, Sawing, Pick-up; 3. Device Conveyance Process

Product structure

BGT-ST : PU FilmUV, Curable PSA, PET Film BGT Wafer Backside Grinding Tape LG Chem Advanced Materials
BGT-ST : PU FilmUV, Curable PSA, PET Film BGT Wafer Backside Grinding Tape LG Chem Advanced Materials

Product Group

    Advanced Adhesive Products and Their Functions

      Product Classification

      Product Classification :Category ,Grade ,Features ,Applications ,Download
      Category Grade Features Applications Download
      BGT
      BGT-ST
      * Thickness (μm) : 150 ~ 200 * Low warpage and burr&residue-free
      Standard type
      BGT
      BGT-TD
      * Thickness (μm) : 100~ 150 * High Shear Strength (Low Die-shift)
      For GAL/DBG processes
      BGT
      BGT-BU
      * Thickness(μm) : 200 ~ 350 * Excellent bump adhesion
      For bumps
      알림
      알림
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