BGT

Back Grinding Tape
BGT Back Grinding Tape LG Chem Advanced Materials Material which protects the wafer surface during back grinding
BGT Back Grinding Tape LG Chem Advanced Materials Material which protects the wafer surface during back grinding

Material which protects the wafer surface during back grinding

BGT (Back Grinding Tape) is a protective tape applied to the wafer surface after IC circuits are formed, during the back grinding process.
It is directly attached to the circuit side to prevent substrate damage and surface contamination, while enhancing the precision of the grinding process.

With excellent physical and chemical properties, BGT reliably protects the wafer pattern and chips throughout processing, contributing to the realization of high-quality packaging.

Applications

PC / Server / Graphics DRAM

PC / Server / Graphics DRAM

Mobile DRAM

Mobile DRAM

NAND

NAND

Communication(SiP / AiP)

Communication(SiP / AiP)

Product functions

• Minimizes wafer warpage to ensure a stable back grinding process
• Maintains uniform thickness with excellent TTV (Total Thickness Variation) control
• Prevents chip damage by protecting the pattern side and minimizing die shift
• Enhances process stability by absorbing shock and foreign particles generated during back grinding
• Enables clean separation without residue through easy removal after UV exposure
1. BGT Process: Mounting, Grinding, Peeling; 2. Dicing Process: Dicing Tape, Sawing, Pick-up; 3. Device Conveyance Process
1. BGT Process: Mounting, Grinding, Peeling; 2. Dicing Process: Dicing Tape, Sawing, Pick-up; 3. Device Conveyance Process

Product structure

BGT-ST : PU FilmUV, Curable PSA, PET Film BGT Wafer Backside Grinding Tape LG Chem Advanced Materials
BGT-ST : PU FilmUV, Curable PSA, PET Film BGT Wafer Backside Grinding Tape LG Chem Advanced Materials

Product Group

    Advanced Adhesive Products and Their Functions

      Product Classification

      Product Classification :Category ,Grade ,Features ,Applications ,Download
      Category Grade Features Applications Download
      BGT
      BGT-TD (Thin Die)
      • Maintains uniform thickness with excellent TTV (Total Thickness Variation, < 3μm)
      • Minimizes corner cracks to prevent chip edge damage
      • Prevents die shift to maintain high-precision patterns and improve post-process stability
      • Thickness ≤ 100um NAND
      BGT
      BGT-BU (Bump)
      • Forms a stable surface during back grinding with excellent bump absorption characteristics
      • Easy Peel enables clean removal without residue
      • Bump Height ≤ 60um DRAM

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