BUF
Insulating film material for multilayer structures in high‑performance semiconductor package substrates
BUF (Build‑Up Film) is a high‑insulation film material used to form insulating layers between circuit layers in the multilayer structures of high‑performance semiconductor package substrates such as FC‑BGA. BUF plays a key role in advanced semiconductor packaging by enabling high‑density wiring, improving signal‑transmission quality, and ensuring substrate stability.
As package architectures evolve toward higher integration and increased layer counts, BUF performance has become increasingly critical. With excellent dielectric properties, dimensional stability, and reliability, LG Chem’s BUF enhances customers’ design flexibility and product robustness, delivering essential material value for next‑generation high‑performance semiconductor development.
Features
Excellent Dielectric Properties
Thermal & Mechanical Stability
Fine‑patterning & Multilayer Process Stability
Outstanding Moisture & Chemical Resistance
Applications
Product Functions and Structure
