BUF

Build-Up Film
BUF Build-Up Film LG Chem Advanced Materials Insulating film material for multilayer structures in high‑performance semiconductor package substrates
BUF Build-Up Film LG Chem Advanced Materials Insulating film material for multilayer structures in high‑performance semiconductor package substrates

Insulating film material for multilayer structures in high‑performance semiconductor package substrates

BUF (Build‑Up Film) is a high‑insulation film material used to form insulating layers between circuit layers in the multilayer structures of high‑performance semiconductor package substrates such as FC‑BGA. BUF plays a key role in advanced semiconductor packaging by enabling high‑density wiring, improving signal‑transmission quality, and ensuring substrate stability.

As package architectures evolve toward higher integration and increased layer counts, BUF performance has become increasingly critical. With excellent dielectric properties, dimensional stability, and reliability, LG Chem’s BUF enhances customers’ design flexibility and product robustness, delivering essential material value for next‑generation high‑performance semiconductor development.

Features

Excellent Dielectric Properties

Thermal & Mechanical Stability

Fine‑patterning & Multilayer Process Stability

Outstanding Moisture & Chemical Resistance

Applications

Product Functions and Structure

Product Group

    Advanced Adhesive Products and Their Functions

      Product Classification

      Product Classification :Category ,Grade ,Features ,Applications ,Download
      Category Grade Features Applications Download
      BUF
      Low CTE
      • Excellent heat resistance and reliability enabled by high‑Tg characteristics
      • High reliability enabled by low‑CTE characteristics
      • FC-BGA (PC CPU/GPU, Automotive MCU/ADAS, DTV Controller)
      BUF
      Fine Pattern
      • Fine‑pattern capability enabled by nano‑filler engineering (L/S ≤ 4/4 µm)
      • High reliability under high‑temperature and high‑humidity conditions enabled by superior moisture resistance
      • FC-BGA(Sever CPU/GPU)
      • Dielectric material for glass substrates
      BUF
      Low Dielectric Loss
      • Performance optimized for high‑speed signal transmission and low‑loss requirements enabled by low‑Df characteristics
      • Crack‑suppression capability enabled by controlled elongation and modulus characteristics
      • FC-BGA (Sever CPU/GPU, Network IC)
      • Dielectric material for glass substrates

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