DAF

Die Attach Film

Film adhesive material for semiconductor package stacking and thinning

DAF (Die Attach Film) is a film‑type adhesive used in semiconductor packaging processes to attach semiconductor chips to substrates or to other chips. It integrates the functions of the dicing tape—which supports the wafer during singulation—and the die bonding tape used to attach the separated chips, enabling simplification of the overall packaging process.

As semiconductor packages become thinner and more highly integrated, the importance of adhesive materials that can minimize the gap between chips while reliably managing thermal and mechanical stress continues to grow. Leveraging ultra‑thin adhesive technology, LG Chem provides DAF solutions with excellent reliability and heat resistance, meeting the demanding requirements of high‑performance semiconductor packages.

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Features

Excellent Bonding Performance

Ultra‑thin

Void Free

Chip Crack Free

Applications

PC / Server DRAM

Mobile DRAM

NAND

Product Functions and Structure

• Uniform‑thickness control ensuring stable bonding quality
• High‑modulus design providing crack‑resistant solutions for thin and ultra‑thin wafers
• Excellent gap‑filling characteristics and void‑free bonding after die‑attach cure enhancing reliability
• High adhesion strength enabling reliable bonding across various substrates and chips
• Superior heat resistance and reliability supporting high‑temperature processes and thermal‑cycling environments
• Compatible with both blade and stealth dicing processes

Product Group

Advanced Adhesive Products and Their Functions

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Product Classification

Product Classification :Category ,Grade ,Features ,Applications ,Download
Category	Grade	Features	Applications
DAF	Normal	• Chip‑to‑substrate and chip‑to‑chip bonding capability • Void‑free performance after molding • High reliability and high thermal‑budget performance	• LPDDR, SSD, uMCP, UFS, eMMC (DAF Thickness : 5, 10, 20㎛)
DAF	High Modulus	• Applicable to thin wafers • Crack‑reduction capability for thin wafers enabled by high‑modulus characteristics during pre‑cure • High reliability enabled by superior void‑free performance	• LPDDR, SSD, uMCP, UFS, eMMC (DAF Thickness : 5, 10, 20㎛)
DAF	High thermal conductivity	• Superior thermal conductivity compared to standard DAF materials • Excellent gap‑fill capability enabled by low‑viscosity characteristics • Applicable to thin wafers • Excellent package‑level reliability	• LPDDR, SSD, uMCP, UFS, eMMC (DAF Thickness : 5, 10, 20㎛)
DAF	FOW (Film Over Wire)	• Chip‑to‑chip bonding and wire‑embedding capability • Void‑free performance after die‑attach curing • Excellent wire‑embedding performance	• LPDDR, uMCP (DAF Thickness : 40, 50, 60 ㎛)
DAF	FOD (Film Over Die)	• Chip embedding and bonding capability • Excellent embedding performance for controllers, chips, and wires • Excellent HAST reliability • Minimized fillet formation	• uMCP, UFS, eMMC (DAF Thickness : 100 ~ 120㎛)

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1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Company name, Email, Phone number, Region

B. The data below may be automatically generated or collected when you use the Service.

- Service usage records (access date and time), IP address, and communication content (When you talk with a consultant at the customer service center, your call will be recorded to safeguard your rights and improve the quality of services.)

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

B. LG Chem collects and uses personal data to process customers’ various questions and requests by confirming their identification or to notify customers about services that have been improved or changed.

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If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

Holding data according to our internal policies - Retained items: Company name, Email, Phone number, Region, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Your Personal Data may be transferred to third party service providers for the purposes of providing information technology, identity management, website/System hosting and management, data analysis, data back-up, security and storage services.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Company name, Email, Phone number, Region	Korea

I agree to the Collection/Usage of Personal Information.

1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Company name, Email, Phone number

B. The data below may be automatically generated or collected when you use the Service.

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

3. Period for Holding and Using Personal Data

If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Company name, Email, Phone number, Region	Korea

I agree to the Collection/Usage of Personal Information.

1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Email, Phone number

B. The data below may be automatically generated or collected when you use the Service.

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

3. Period for Holding and Using Personal Data

If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

Holding data according to our internal policies - Retained items: Email, Phone number, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Email, Phone number	Korea

I agree to the Collection/Usage of Personal Information.