DAF

Die Attach Film
DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages
DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

DAF(Die Attach Film) is an ultra-thin film adhesive used to connect semiconductor chips to circuit boards or chips to chips in the semiconductor packaging process. It is an essential material used in manufacturing flash memories, etc. in the post-manufacturing process of semiconductors. Lamination and manufacturing of thin layers of semiconductors are possible with its excellent reliability and easy processability.

Applications

PC/server DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

PC/server

graphic DRAM DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

graphic DRAM

mobile DRAM DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

mobile DRAM

NAND DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

NAND

AP DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

AP

fingerprint sensor

fingerprint sensor

Product Functions and Structure

· Has excellent pick-up characteristic and processability
· Has void free and anti-heat characteristics and excellent reliability
· Has excellent burial ability through viscosity and cure control

Product Functions and Structure DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages
Product Functions and Structure DAF Die Attach Film LG Chem Advanced Materials Ultra-thin film adhesive material for lamination and slimization of semiconductor packages

DAF Process

DAF Process : Wafer Backside Lamination(WBL), Dicing(Sawing), UV/Expanding, Die Bonding, Chip th substrate
DAF Process : Wafer Backside Lamination(WBL), Dicing(Sawing), UV/Expanding, Die Bonding, Chip th substrate

Product Group

    Advanced Adhesive Products and Their Functions

      Product Classification

      Product Classification :Category ,Grade ,Features ,Applications ,Download
      Category Grade Features Applications Download
      DAF
      Normal
      * Thickness (μm) : 5/ 10 / 20 * Mold Void Free * Can support various dicing processes such as Blade/GAL/DBG
      Chip-to-chip or chip-to-board adhesive film
      DAF
      FOW(Film over Wire)
      *Thickness (μm) : 50 ~ 80 * Pre-cure Void Free *Has excellent fillet and wire burying ability * Has excellent HAST reliability
      Wire-burial type adhesive film
      DAF
      FOD(Film over Die)
      * Thickness (μm) : 90~120 * Pre-cure Void Free * Has excellent controller chip and great void characteristic around wire * Has excellent HAST reliability * Can support various dicing processes such as Blade/GAL/DBG * GAL process is possible
      Controller chip burial type adhesive film
      알림
      알림
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