DAF


Ultra-thin film adhesive material for lamination and slimization of semiconductor packages
DAF(Die Attach Film) is an ultra-thin film adhesive used to connect semiconductor chips to circuit boards or chips to chips in the semiconductor packaging process. It is an essential material used in manufacturing flash memories, etc. in the post-manufacturing process of semiconductors. Lamination and manufacturing of thin layers of semiconductors are possible with its excellent reliability and easy processability.
Applications
Product Functions and Structure
· Has excellent pick-up characteristic and processability
· Has void free and anti-heat characteristics and excellent reliability
· Has excellent burial ability through viscosity and cure control


DAF Process

