NCF

Non-Conductive Film

Ultra‑thin non‑conductive adhesive film for fine‑pitch electrode bonding in advanced semiconductor packages

NCF(Non‑Conductive Film) is an ultra‑thin adhesive film used to precisely bond chips to substrates or other chips in advanced semiconductor packages such as HBM. Designed with excellent insulation properties, it uniformly fills micro‑gaps formed during chip stacking and ensures robust electrode bonding, enabling highly reliable advanced semiconductor packages.

As rapid advances in AI increase the demand for higher‑performance memory packages such as HBM, semiconductor chip‑bonding processes now require even greater precision and stability. LG Chem’s NCF is optimized to meet customers’ package architectures and process conditions, delivering adhesive solutions tailored for next‑generation semiconductor packaging processes.

Product inquiry

Features

Excellent<br>Gap‑filling

Precise Electrode Bonding

High Reliability

Storage & Process Stability

Applications

HBM ( High Bandwidth Memory )

Product Functions and Structure

• High‑filling, high‑bonding solution for high‑density packages such as HBM
• High thermal and mechanical durability for package stability
• Ultra‑thin adhesive film solution supporting multi‑stack HBM architectures
• Optimized curing characteristics with high storage stability

Product Group

Advanced Adhesive Products and Their Functions

Product inquiry

Product Classification

Product Classification :Category ,Grade ,Features ,Applications ,Download
Category	Grade	Features	Applications	Download
NCF	Normal	• Excellent filling and bonding performance enabled by a high‑flow design • High reliability supported by stable thermal and mechanical properties • Ultra‑thin adhesive film solution enabled by precision coating technology	• TSV DRAM • HBM

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Holding data according to our internal policies - Retained items: Company name, Email, Phone number, Region, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

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Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Company name, Email, Phone number, Region	Korea

I agree to the Collection/Usage of Personal Information.

1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Company name, Email, Phone number

B. The data below may be automatically generated or collected when you use the Service.

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

3. Period for Holding and Using Personal Data

If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Company name, Email, Phone number, Region	Korea

I agree to the Collection/Usage of Personal Information.

1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Email, Phone number

B. The data below may be automatically generated or collected when you use the Service.

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

3. Period for Holding and Using Personal Data

If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

Holding data according to our internal policies - Retained items: Email, Phone number, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Email, Phone number	Korea

I agree to the Collection/Usage of Personal Information.

NCF

Ultra‑thin non‑conductive adhesive film for fine‑pitch electrode bonding in advanced semiconductor packages

Features

Excellent<br>Gap‑filling

Precise Electrode Bonding

High Reliability

Storage & Process Stability

Applications

HBM ( High Bandwidth Memory )

Product Functions and Structure

• High‑filling, high‑bonding solution for high‑density packages such as HBM• High thermal and mechanical durability for package stability• Ultra‑thin adhesive film solution supporting multi‑stack HBM architectures• Optimized curing characteristics with high storage stability

Product Group

Advanced Adhesive Products and Their Functions

Product Classification

• High‑filling, high‑bonding solution for high‑density packages such as HBM
• High thermal and mechanical durability for package stability
• Ultra‑thin adhesive film solution supporting multi‑stack HBM architectures
• Optimized curing characteristics with high storage stability