PID

Photo Imageable Dielectric

High‑performance photo‑imageable insulation material for forming micro‑circuit patterns in advanced semiconductor packages

PID(Photo Imageable Dielectric) is a photosensitive insulating material used to form the fine circuit patterns that connect semiconductor chips to substrates in advanced semiconductor packages. It enhances package performance and reliability by enabling ultra‑fine circuit formation and ensuring stable electrical insulation.

As advances in AI increase the demand for higher‑performance semiconductors, LG Chem delivers PID materials featuring high‑resolution patterning and exceptional reliability essential for ultra‑fine circuit fabrication. Through an extensive lineup of liquid and film‑type products, we provide optimized material solutions tailored to customers’ process conditions and technical challenges.

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Features

High Reliability

High‑resolution

Low‑temperature Curing

Eco‑friendly (PFAS Free)

Applications

Power semiconductors

Mobile AP

High‑performance Semiconductors for AI Applications

Product Functions and Structure

• High‑resolution performance and high reliability enabled by proprietary material design
• Stable low‑temperature curing with low shrinkage and low moisture absorption for improved process stability and reliability
• Eco‑friendly formulation free of PFAS and organic solvents such as NMP and toluene
• Film‑type PID supporting fine‑line circuitry on large‑area panels and substrates

Product Group

Advanced Adhesive Products and Their Functions

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Product Classification

Product Classification :Category ,Grade ,Features ,Applications ,Download
Category	Grade	Features	Applications
PID	Positive Type - Liquid	• Excellent thermal, mechanical, and electrical performance	• FO‑WLP / PLP (PMIC, Mobile AP) • 2.xD (AI accelerators) • Dielectric material for glass substrates
PID	Positive Type - Liquid(High Resolution)	• High‑resolution capability for fine‑line circuitry in advanced, high‑density semiconductor devices • Low‑shrinkage characteristics supporting multilayer circuitry and high‑density package fabrication	• FO‑WLP / PLP (PMIC, Mobile AP) • 2.xD (AI accelerators) • Dielectric material for glass substrates
PID	Negative Type – Liquid	• High reliability, high resolution, and strong adhesion to substrates • Low dielectric constant (Low Dk) and low dissipation factor (Low Df) for reduced crosstalk and leakage during high‑speed signal transmission	• FO‑WLP / PLP (PMIC, Mobile AP) • 2.xD (AI accelerators) • Dielectric material for glass substrates
PID	Negative Type - Film	• Applicable to film lamination processes • Applicable to large‑area panels	• FO‑WLP / PLP (PMIC, Mobile AP) • 2.xD (AI accelerators) • Dielectric material for glass substrates

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LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Company name, Email, Phone number, Region	Korea

I agree to the Collection/Usage of Personal Information.

1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Company name, Email, Phone number

B. The data below may be automatically generated or collected when you use the Service.

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

3. Period for Holding and Using Personal Data

If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Company name, Email, Phone number, Region	Korea

I agree to the Collection/Usage of Personal Information.

1. Personal Data Collected

A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

- Email, Phone number

B. The data below may be automatically generated or collected when you use the Service.

2. Purposes of Collecting and Using Personal Data

A. LG Chem collects and uses personal data to provide customized services to their customers.

3. Period for Holding and Using Personal Data

If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

Holding data according to our internal policies - Retained items: Email, Phone number, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

4. Cross-border Transfer

Personal Data collected by LG Chem may be transferred, where it necessary:

• to meet the purpose for which you have submitted the information;

• to enable you to be provided with information at a later date which may be of relevance and interest to you based on the nature and purpose of your requests;

• maintaining our operations or relationship management systems;

• security, quality and risk management reviews; or

• complying with any law and/or regulation.

Service Providers	Address	Transferred Personal Data	Data Center
LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Email, Phone number	Korea

I agree to the Collection/Usage of Personal Information.