CCL/PPG

Copper Clad Laminate/Prepreg
CCL/PPG Copper Clad Laminate/Prepreg LG Chem Advanced Materials Core material for semiconductor package substrate manufacturing
CCL/PPG Copper Clad Laminate/Prepreg LG Chem Advanced Materials Core material for semiconductor package substrate manufacturing

Core material for semiconductor package substrate manufacturing

CCL(Copper Clad Laminate) is a core material used in PCBs for semiconductor packages, consisting of copper foil laminated onto both sides of an insulating layer. It serves as the structural support layer of the substrate while also providing electrical connection and insulation for circuit patterns—making it a key material that determines the reliability and electrical properties of the substrate.

LG Chem provides CCL solutions with excellent electrical properties and high reliability in response to the evolution of advanced semiconductor packaging technologies and the growing demands for miniaturization, thinning, and high performance. Through a diverse product lineup optimized for key material properties by application, we address customers’ technical challenges and offer a stable material foundation for the development of next‑generation electronic devices.

Features

Excellent Dielectric Properties

Thermal & Mechanical Stability

Superior processability and durability

Outstanding Moisture & Chemical Resistance

Applications

Product functions and structure

• Fine‑thickness‑control technology enabling superior non‑wet‑free flip‑chip bonding performance
• Low‑CTE, low‑stress properties providing effective warpage‑control solutions
• High‑strength, thin‑substrate design enabling lightweight construction and enhanced durability
• Low‑Dk and low‑Df dielectric properties supporting high‑speed signal transmission
Substrate: Substrate, DAF, First Chip, DAF, Second Chip; CCL: Copper-clad sides, inorganic mix, glass fiber, thermosetting resin; PPG: CCL w/o copper, inorganic mix, glass fiber, thermosetting resin
Substrate: Substrate, DAF, First Chip, DAF, Second Chip; CCL: Copper-clad sides, inorganic mix, glass fiber, thermosetting resin; PPG: CCL w/o copper, inorganic mix, glass fiber, thermosetting resin

Product Group

    Advanced Adhesive Products and Their Functions

      Product Classification

      Product Classification :Category ,Grade ,Features ,Applications ,Download
      Category Grade Features Applications Download
      CCL/PPG
      PC / Server DRAM
      • Advanced non‑wet‑free flip‑chip bonding solution
      • Low‑Dk dielectric characteristics enabling high‑speed signal transmission
      • DDR, GDDR
      • TSV(Through Silicone Via) DRAM
      CCL/PPG
      Mobile DRAM - Smart device
      • Wide Tg window enabling stable package warpage control across diverse process conditions
      • Low‑CTE and low‑stress properties ensuring reliability in high‑density packages
      • Mobile PoP, discrete type memory
      • LPDDR
      CCL/PPG
      Mobile DRAM - Automotive and Computing
      • Excellent BLR(Board Level Reliability) performance delivering high reliability under repeated T/C conditions
      • Automotive(Infotainment, ECU, ADAS)
      • LPDDR(SOCAMM)
      CCL/PPG
      NAND
      • Ultra‑thin CCL using high‑strength, high‑rigidity materials ensuring superior crack resistance
      • uMCP, UFS, eMMC
      • SSD controller
      CCL/PPG
      Communication - SiP(System in Package)
      • CCL with low‑Dk characteristics optimized for high‑frequency signal transmission
      • 5G communication(Smart device, wearable, IoT)
      CCL/PPG
      Communication - AiP(Antenna in Package)
      • Low‑Dk and low‑Df CCL minimizing high‑frequency signal loss and maximizing antenna performance
      • mmWave antenna(Mobile)

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