PPG is manufactured by impregnating glass fibers with resin and then hardening them, and plays the role of a bonding sheet in the stacking process of package substrate(connects semiconductors to PCB). CCL, a laminated Cu foil layer formed by coating both sides of PPG with copper, plays the role of an insulator. CCL and PPG are key materials of a semiconductor's IC package substrate. With their excellent electrical characteristics and reliability, they make possible miniaturization and thin-layer manufacturing of semiconductor devices.
· War page control solution with low stress and low shrinking rate
· Can produce thin-layered board with high strength
· Can produce high-speed/low-loss substrate with low Dk&Df