CCL/PPG

Copper Clad Laminate/Prepreg
CCL/PPG Copper Clad Laminate/Prepreg LG Chem Advanced Materials Key materials of semiconductor IC package substrates
CCL/PPG Copper Clad Laminate/Prepreg LG Chem Advanced Materials Key materials of semiconductor IC package substrates

Key materials of semiconductor IC package substrates

CCL, or Copper Clad Laminate, is a composite material consisting of copper foil laminated on both sides of an insulating substrate.
It serves as a key material in IC package printed circuit boards (PCBs), providing electrical connectivity, insulation, and mechanical support for electronic devices.

LG Chem offers advanced CCL solutions designed to meet the evolving demands of semiconductor packaging technologies, including miniaturization, thinning, and high performance.
With excellent electrical properties and high reliability, our CCL products are optimized for various applications and core material characteristics.
Through a diverse product lineup tailored to specific needs, we help customers overcome technical challenges and establish a stable material foundation for next-generation electronic device development.

Features

Excellent insulation performance

Thermal and mechanical stability

Superior processability and durability

Moisture and chemical resistance

Applications

PC / Server / Graphics DRAM CCL/PPG Copper Clad Laminate/Prepreg LG Chem Advanced Materials Key material for IC package substrate for semiconductors

PC / Server / Graphics DRAM

Mobile DRAM CCL/PPG Copper Clad Laminate/Prepreg LG Chem Advanced Materials Key material for IC package substrate for semiconducto

Mobile DRAM

NAND CCL/PPG Copper Clad Laminate/Prepreg LG Chem Advanced Materials Key material for IC package substrate for semiconducto

NAND

Communication(SiP / AiP) CCL/PPG Copper Clad Laminate/Prepreg LG Chem Advanced Materials Key material for IC package substrate for semiconducto

Communication(SiP / AiP)

Product functions and structure

• Provides an excellent non-wet free flip-chip bonding solution through advanced ultra-thin thickness control technology
• Offers warpage control solutions based on low thermal expansion and low stress characteristics
• Enables lightweight and durable high-strength thin substrates for compact device designs
• Implements substrates with low dielectric constant (Low Dk) and low dissipation factor (Low Df) for high-speed signal transmission
Substrate: Substrate, DAF, First Chip, DAF, Second Chip; CCL: Copper-clad sides, inorganic mix, glass fiber, thermosetting resin; PPG: CCL w/o copper, inorganic mix, glass fiber, thermosetting resin
Substrate: Substrate, DAF, First Chip, DAF, Second Chip; CCL: Copper-clad sides, inorganic mix, glass fiber, thermosetting resin; PPG: CCL w/o copper, inorganic mix, glass fiber, thermosetting resin

Product Group

    Advanced Adhesive Products and Their Functions

      Product Classification

      Product Classification :Category ,Grade ,Features ,Applications ,Download
      Category Grade Features Applications Download
      CCL/PPG
      PC / Server / Graphics DRAM
      • Provides an advanced non-wet free flip-chip bonding solution
      • Enables high-speed signal transmission through substrates with low dielectric constant (Low Dk) characteristics
      • DDR, GDDR
      • TSV(Through Silicone Via)
      CCL/PPG
      Mobile DRAM - Smart device
      • Stable package warpage control across various process conditions enabled by a wide glass transition temperature (Tg) range
      • Ensures reliability of high-density packages through low thermal expansion and low stress characteristics
      • Mobile PoP, discrete type memory
      • LPDDR
      CCL/PPG
      Mobile DRAM - Automotive and Computing
      • Delivers high reliability under repeated thermal cycling (T/C) conditions through excellent Board Level Reliability (BLR) performance
      • Automotive(Infotainment, ECU, ADAS)
      • LPDDR(SOCAMM)
      CCL/PPG
      NAND
      • Achieves excellent crack resistance with ultra-thin CCL based on high-strength and high-rigidity materials
      • uMCP, UFS, eMMC
      • SSD controller
      CCL/PPG
      Communication - SiP(System in Package)
      • Optimized for high-frequency signal transmission through CCL with low dielectric constant (Low Dk) characteristics
      • 5G communication(Smart device, wearable, IoT)
      CCL/PPG
      Communication - AiP(Antenna in Package)
      • Minimizes high-frequency signal loss and maximizes antenna performance through CCL with low dielectric constant (Low Dk) and low dissipation factor (Low Df) characteristics
      • mmWave antenna(Mobile)

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