CCL/PPG
Core material for semiconductor package substrate manufacturing
CCL(Copper Clad Laminate) is a core material used in PCBs for semiconductor packages, consisting of copper foil laminated onto both sides of an insulating layer. It serves as the structural support layer of the substrate while also providing electrical connection and insulation for circuit patterns—making it a key material that determines the reliability and electrical properties of the substrate.
LG Chem provides CCL solutions with excellent electrical properties and high reliability in response to the evolution of advanced semiconductor packaging technologies and the growing demands for miniaturization, thinning, and high performance. Through a diverse product lineup optimized for key material properties by application, we address customers’ technical challenges and offer a stable material foundation for the development of next‑generation electronic devices.
Features
Excellent Dielectric Properties
Thermal & Mechanical Stability
Superior processability and durability
Outstanding Moisture & Chemical Resistance
Applications
Product functions and structure
• Low‑CTE, low‑stress properties providing effective warpage‑control solutions
• High‑strength, thin‑substrate design enabling lightweight construction and enhanced durability
• Low‑Dk and low‑Df dielectric properties supporting high‑speed signal transmission
