CCL/PPG｜ LG Chem

CCL/PPG Copper Clad Laminate/Pre Preg

Key material for IC package substrate for semiconductors

PPG is manufactured by impregnating glass fibers with resin and then hardening them, and plays the role of a bonding sheet in the stacking process of package substrate(connects semiconductors to PCB). CCL, a laminated Cu foil layer formed by coating both sides of PPG with copper, plays the role of an insulator. CCL and PPG are key materials of a semiconductor's IC package substrate. With their excellent electrical characteristics and reliability, they make possible miniaturization and thin-layer manufacturing of semiconductor devices.

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Applications

PC/server DRAM

mobile DRAM

NAND

graphic DRAM

SiP/communication semiconductor(5G)

Product functions and structure

· Excellent flip chip solutions with fine thickness control and non-wet free characteristic
· War page control solution with low stress and low shrinking rate
· Can produce thin-layered board with high strength
· Can produce high-speed/low-loss substrate with low Dk&Df

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[CCL/PPG] Delivering 5G signals from semiconductor chips for communication

Semiconductors for communication are one of the keys to implementing 5G technology. They are a ty...

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Product Classification

Product Classification :Category ,Grade ,Features ,Applications ,Download
Category	Grade	Features	Applications
CCL/PPG	PC/server DRAM	• BOC: general-purpose product • Flip chip: excellent flip chip joining solution with low Dk(non-wet free)	PC/server DRAM
CCL/PPG	Graphic DRAM	• Can handle high-speed processing with low Dk has excellent flip chip joining solution with low Dk(non-wet free)	Graphic DRAM
CCL/PPG	Mobile DRAM	• Has product line-up that is responsive to various CTE and stresses •Can produce thin and high-strength substrate • Can provide low and optimal warpage control with a wide range of responses to Tg •Has excellent anti-crack feature and high reliability from T/C(Thermo Cycle) test	Mobile DRAM
CCL/PPG	NAND	•Has product line up responsive to various CTE characteristics •Can produce thin and high-strength substrate •Has excellent anti-crack feature and high reliability from T/C(Thermo Cycle) test	NAND
CCL/PPG	SiP/5G	• Can produce high-speed/low-loss substrate with low Dk&Df • Has wide process margin and excellent processability	SiP/communication semiconductor(5G)

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If you do not want our company to hold your personal data, you may request that we delete it at any time. The data below shall be kept for the specified period for the reasons listed.

Holding data according to our internal policies - Retained items: Company name, Email, Phone number, Region, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

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