CCL/PPG
Key materials of semiconductor IC package substrates
CCL, or Copper Clad Laminate, is a composite material consisting of copper foil laminated on both sides of an insulating substrate. It serves as a key material in IC package printed circuit boards (PCBs), providing electrical connectivity, insulation, and mechanical support for electronic devices. LG Chem offers advanced CCL solutions designed to meet the evolving demands of semiconductor packaging technologies, including miniaturization, thinning, and high performance. With excellent electrical properties and high reliability, our CCL products are optimized for various applications and core material characteristics. Through a diverse product lineup tailored to specific needs, we help customers overcome technical challenges and establish a stable material foundation for next-generation electronic device development.
Features
Excellent insulation performance
Thermal and mechanical stability
Superior processability and durability
Moisture and chemical resistance
Applications
Product functions and structure
• Offers warpage control solutions based on low thermal expansion and low stress characteristics
• Enables lightweight and durable high-strength thin substrates for compact device designs
• Implements substrates with low dielectric constant (Low Dk) and low dissipation factor (Low Df) for high-speed signal transmission
