CCL/PPG

Copper Clad Laminate/Pre Preg

Key material for IC package substrate for semiconductors

PPG is manufactured by impregnating glass fibers with resin and then hardening them, and plays the role of a bonding sheet in the stacking process of package substrate(connects semiconductors to PCB). CCL, a laminated Cu foil layer formed by coating both sides of PPG with copper, plays the role of an insulator. CCL and PPG are key materials of a semiconductor's IC package substrate. With their excellent electrical characteristics and reliability, they make possible miniaturization and thin-layer manufacturing of semiconductor devices.

Product inquiry

Applications

PC/server DRAM

mobile DRAM

NAND

graphic DRAM

SiP/communication semiconductor(5G)

Product functions and structure

· Excellent flip chip solutions with fine thickness control and non-wet free characteristic
· War page control solution with low stress and low shrinking rate
· Can produce thin-layered board with high strength
· Can produce high-speed/low-loss substrate with low Dk&Df

Substrate: Substrate, DAF, First Chip, DAF, Second Chip; CCL: Copper-clad sides, inorganic mix, glass fiber, thermosetting resin; PPG: CCL w/o copper, inorganic mix, glass fiber, thermosetting resin

Product Group

Advanced Adhesive Products and Their Functions

LG Chem in Everyday Life

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[CCL/PPG] Delivering 5G signals from semiconductor chips for communication

Semiconductors for communication are one of the keys to implementing 5G technology. They are a ty...

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Product inquiry

Product Classification

Product Classification :Category ,Grade ,Features ,Applications ,Download
Category	Grade	Features	Applications
CCL/PPG	PC/server DRAM	• BOC: general-purpose product • Flip chip: excellent flip chip joining solution with low Dk(non-wet free)	PC/server DRAM
CCL/PPG	Graphic DRAM	• Can handle high-speed processing with low Dk has excellent flip chip joining solution with low Dk(non-wet free)	Graphic DRAM
CCL/PPG	Mobile DRAM	• Has product line-up that is responsive to various CTE and stresses •Can produce thin and high-strength substrate • Can provide low and optimal warpage control with a wide range of responses to Tg •Has excellent anti-crack feature and high reliability from T/C(Thermo Cycle) test	Mobile DRAM
CCL/PPG	NAND	•Has product line up responsive to various CTE characteristics •Can produce thin and high-strength substrate •Has excellent anti-crack feature and high reliability from T/C(Thermo Cycle) test	NAND
CCL/PPG	SiP/5G	• Can produce high-speed/low-loss substrate with low Dk&Df • Has wide process margin and excellent processability	SiP/communication semiconductor(5G)

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A. The company collects the following types of personal data to respond to your inquiries and provide consultation.

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B. The data below may be automatically generated or collected when you use the Service.

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Holding data according to our internal policies - Retained items: Email, Phone number, type of inquiry, subject, and content - Retention Reason: Preventing service interference and cooperating in the investigations of illegal users - Retention period: 1 years from the date of processing the inquiry

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LG CNS, Ltd	Parc1.Tower1, 108, Yeoui-daro Yeongdeungpo-gu, Seoul, 07335, Republic of Korea	Email, Phone number	Korea

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CCL/PPG

Key material for IC package substrate for semiconductors

Applications

PC/server DRAM

mobile DRAM

NAND

graphic DRAM

SiP/communication semiconductor(5G)

Product functions and structure

· Excellent flip chip solutions with fine thickness control and non-wet free characteristic· War page control solution with low stress and low shrinking rate· Can produce thin-layered board with high strength· Can produce high-speed/low-loss substrate with low Dk&Df

Product Group

Advanced Adhesive Products and Their Functions

LG Chem in Everyday Life

[CCL/PPG] Delivering 5G signals from semiconductor chips for communication

Product Classification

· Excellent flip chip solutions with fine thickness control and non-wet free characteristic
· War page control solution with low stress and low shrinking rate
· Can produce thin-layered board with high strength
· Can produce high-speed/low-loss substrate with low Dk&Df